Journal of Microelectronics and Electronic Packaging
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Key Metrics
Journal Specifications
- PublisherInternational Microelectronics And Packaging Society
Year-wise Publication
- 5Y
- 10Y
FAQs
What is the H-index. SNIP score, Citescore and SJR of Journal of Microelectronics and Electronic Packaging? 
Journal of Microelectronics and Electronic Packaging has a H-index score of 18, Citescore of 1.2, SNIP score of 0.33, & SJR of Q4
Who is the publisher of Journal of Microelectronics and Electronic Packaging?
The publisher of Journal of Microelectronics and Electronic Packaging is International Microelectronics And Packaging Society.
How can I view the journal metrics of Journal of Microelectronics and Electronic Packaging on editage?
For the Journal of Microelectronics and Electronic Packaging metrics, please refer to the section above on the page.
What is the eISSN and pISSN number of Journal of Microelectronics and Electronic Packaging?
The eISSN number is 1555-8037 and pISSN number is 1551-4897 for Journal of Microelectronics and Electronic Packaging.
What is the focus of this journal?
The journal covers a wide range of topics inlcuding Printed circuit board, Mold, Integrated circuit packaging, Redistribution layer, Co-fired ceramic, Sample preparation.
Why is it important to find the right journal for my research?
Choosing the right journal ensures that your research reaches the most relevant audience, thereby maximizing its scholarly impact and contribution to the field.
Can the choice of journal affect my academic career?
Absolutely. Publishing in reputable journals can enhance your academic profile, making you more competitive for grants, tenure, and other professional opportunities.
Is it advisable to target high-impact journals only?
While high-impact journals offer greater visibility, they are often highly competitive. It's essential to balance the journal's impact factor with the likelihood of your work being accepted.